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The Line Card

ARAS

Aras Power Technologies, founded by Fariborz Rad, provides leading edge power delivery solutions for the challenging power requirements found in today's marketplace. Aras offers conventional, off the shelf, AC/DC and DC/DC solutions, as well as custom power supply design and manufacturing.

  • AC/DC Switching Power Supplies & DC/DC Front Ends
  • Closed Frame & Open U Channel, Single or Multiple Outputs
  • 90% Efficiency
  • Industry leading Lead Times for design and manufacturing
  • High Density, High Reliability

Broad

  • Offshore Printed Circuit Board Manufacturer (Guangzhou, China)
  • Low Cost – Medium to high volume supplier
    HDI Capability
  • 2 to 16 Layers
  • ISO14001, ISO900L, ISO/TS 16949 and UL Certified
  • Width and spacing to .003
  • Controlled Impedance
  • Minimum SMT Pitch: 16 mil
  • Lead Free Surface Finish
  • Sony, Canon, Pioneer, and Samsung Green Partner Certification

Cortina Systems

  • Leading supplier of intelligent communication solutions through innovative advanced port processing and connectivity to the Core, Metro, Access and Enterprise Market Segments.
  • State-of-the-art high speed analog digital integration propels delivery of a wide suite of products that address performance, density and flexibility demands and allow faster time-to-market, longer time-in-market, and increased revenue opportunities.
    • SONET/SDH
    • Ethernet
    • RPR & ATM
    • FEC/OTN
    • PDH Telecom
    • PON
    • Digital Home Processors (NAS and Wireless Gateways)
eASIC
  • eASIC is a fabless semiconductor company offering NEW ASIC devices that reduce the overall fabrication cost and time of customized silicon devices.
  • Employing a unique combination of FPGA like logic-cells, via-layer customizable routing, eASIC offers zero mask charges and no minimum order quantity with 5 weeks turnaround.
  • eASIC offers a soft IP portfolio including Tensilica Diamond cores, AMBA peripherals, H.264 encoders, PCI Express, DDR2 and Ethernet MAC among others.
  • eASIC’s (90nm) Nextreme and (45nm) Nextreme-2 devices provide FPGA designers with up to 80% lower power with significantly lower cost without the up-front costs and risks of standard cell ASICs.
eASIC

Ensphere Solutions, Inc., is a semiconductor company with decades of experience developing highly complex mixed signal Integrated Circuits (ICs) serving many tier I customers worldwide.

Applications - With a focus on communication markets (10G EPON, 100G Ethernet, and Fiber Optics), products are designed to enhance system performance and lower power consumption.

IP Cores - A blend of standard and subsystem analog and mixed signal IP cores are offered for System on Chip (SoC). These IP cores (both Standard IPs and Subsystem IPs) are designed and validated in advanced process node at major foundries, and can easily be ported to other foundries or process nodes.

Design Services - Complete turn-key, application-specific SoC semiconductor solutions are offered. Ensphere can design, validate and deliver a custom SoC design to any customer design specification.

Optical Communications - Advanced connectivity semiconductor ICs for GPON and EPON applications are designed using advanced process technologies for highest performance and lowest power consumption.

Epson

Epson designs, develops and markets products for graphics:

  • LCD drivers and controllers
  • Mobile graphic engines with camera interface and multiple panel control
  • Application specific integrated circuits (standard cell, embedded arrays, gate arrays)
  • FPGA conversions
  • Low power microcontrollers, especially for mechanical applications
Hirose
  • Broad Product Offering of: High density, microminiature Board to Board, FFC/FPC, I/O and Circular connectors Industry Standard connectors
  • PCMCIA, CF, SD, Memory Stick, Smart Media, HDMI, SIM, Mini USB, Compact PCI, & Din 41612
  • Industry Leading and Standard Coaxial connectors - BNC, SMA, TNC. Industry leading U.FL & W.FL and cable assemblies
  • Fiber Optics: Connectors, Attenuators and Terminators for Industry Standard SC, FC and MU
  • High Speed Mezzanine Connectors: IT3 mezzanine connector system can transmit differential, single ended and power through one package. It is stackable from 15-38mm.
Kinpo
  • Kinpo Group is a world wide top leading ODM/EMS Partner, currently ranked #4. (Compal, Cal-Comp, Arcadyan, and Acbel)
  • For more than thirty years, Kinpo utilizes an innovative approach to investing and diversifying its product lines in order to broaden the scope of its global business.
  • Kinpo's key product lines include Digital Consumer, Telecommunication, Data-Communication, and IA Products.
  • ODM, CDM, JDM, OEM and CM Services Available
Kinpo
  • MEMSIC Inc. has developed industry breakthrough MEMS, wireless sensors and system integration technologies enabling leading edge solutions with innovative algorithms and applications
  • MEMSIC has established itself as the industry leader in low cost Accelerometers and Magnetic Sensors. Their products target diverse market segments including consumer electronics, industrial automation and aerospace.

Phihong is an industry leading designer, manufacturer and supplier of power conversion products:

  • Technology Leader in PoE UNH-10L Compliant Solutions
  • 8-48 ports for switch and blade power designs
  • Mid-span power solutions for:
    • IEEE 802.3af and IEEE 802.3at
    • Ultra PoE
  • Fully compliant DC-DC splitters; 14-45 watts
  • Market share leader in CEC complaint regulated and unregulated adapters; 4-6 watts output
  • AC/DC switch-mode open-frame, bracket mount, and enclosed power supplies; 15-500 watts
  • Battery Chargers, Desktop cradle chargers, and Vehicle power adapters
  • Mobile product accessories for the networking, telecommunications, consumer electronics, portable, audio/video, home entertainment and power tool industries

PowerShift

WBENC

 

Stocking Representative specializing in:

  • Printed Circuit Boards (PCB)
    • Manage your PCB requirements from PO to Freight Forwarder
    • 2 to 14 Layers, HDI, ISO 9002, 1400, & Qs9000 Certified
    • Lead Free Options
    • Custom Power Supplies
  • High Reliability, High Efficiency
    • Quick Turn Design, 300W to 1200W single or multi output
    • Engineering Support in Milpitas, CA, Engineering Design Center in Taiwan, Manufactured in China
  • Design Services
    • Analog or Digital
    • IP Cores
    • Transceiver, SERTES
    • Light Peak Technology
    • Wireless
Pulse

Industry leader in designing and manufacturing passive magnetic components. With the recent purchases of LK and Larsen, Pulse is now a leader in antenna technology. Pulse has a complete selection of the following for Data Networking, Power, Telecom, and Broadband Applications:

  • Inductors
  • Transformers
  • Chokes
  • Filter modules
  • Non filtered connectors
  • Broad antenna offering
Silicon Image

SteelVine - All storage-related products (controllers, port-multipliers, HBAs, bridges, etc.) that enable simple, reliable, scalable storage in consumer devices.

VastLane - Our HDMI products that enable the secure distribution of high-performance digital video and audio connections in PC and CE devices.

PinnaClear - Our new family of highly integrated video processors that deliver precision rendering of digital content.

Silicon Image

#1 Manufacturer of DC Fans and Blowers

Designer and manufacturer of a full range of high-performance fans, blowers and coolers

  • DC brushless fans
  • AC fans
  • DC blowers
  • CPU coolers
  • HDMI Cables
  • Custom Cooling Solution

Manufactures some of the industries smallest, thinnest and most power efficient fans and blowers in sizes ranging from 0.315 (8mm) to 10 inches (250mm) in outside diameter and from 0.157 inches (4mm) to 1.5 inches (38mm) in thickness

  • More than 700 different standard models are available
  • Introduced the “Super Green” family of fans in 2009, 50% power reduction, very efficient
Toshiba

The World Leader in CMOS Technology
for Highly Integrated Systems

  • Acknowledged Leader in Deep Submicron Process CMOS ASIC (or SOC) and Foundry Services – 90, 65 45, and 32 nm
  • Standard Cell, Embedded MIPS, ARM DRAM, SRAM & HS I/O
  • High Speed Storage Solutions
  • ASSP: Networking I.C., Multimedia
  • Memory: World's largest supplier of NAND Flash devices including Nor, MCP and SDD
  • Microprocessors: RISC/MIPS, 16, 32, and 64 Bit-CISC, 4, 8, and 16 Bit Microcontrollers
  • Complete line up of Discrete Products
  • State of the art, active color matrix LCD's
  • CCD and CMOS Camera Modules
TR Manufacturing
  • Fiber Optic Components and Interconnects
  • Copper Interconnects and Harnesses
  • Electro -Mechanical Assemblies
  • ISO 9000 Certified
  • 15 years of providing a wide variety of diverse technology solutions.
  • Quality, Reliability and Flexibility are promoted from prototyping through the manufacturing process.
Wireless 2 Wireless 
  • Complete System-In-Package, Cost Effective Wireless Solutions
  • WiFi, GPS, Bluetooth
  • Partners with Best in Class Wireless Suppliers; Sirf, Marvell, CSR, etc.
  • Smallest Size, Lowest Power, Best RF, State of the Art Coexistence.
Winbond 

Designs, manufacturers, and markets memory solutions to global customers in the areas of DRAM, Mobile RAM, and Flash. Owns and operates its own 300mm fabrication facility. Offering both packaged solutions and Known Good Die (KGD) solutions.

  • Specialty DRAM
    • Single Data Rate (SDR) Synchronous DRAM (SDRAM)
    • Double Data Rate (DDR) Synchronous DRAM (SDRAM)
  • Mobile RAM
    • Pseudo SRAM
    • Low Power SDR SDRAM
    • Low Power DDR SDRAM
  • Flash Memory (NOR)
    • Serial Flash
    • Parallel Flash